Semiconductors

As the industry moves toward 3D stacked dies and advanced heterogenous integration, thermal management has become the primary bottleneck for performance. Standard thermal solvers often fail to capture the micro-scale fluid dynamics required for advanced cooling or the rapid heat transients in high-performance computing. BeyondMath provides a multi-scale thermal engine that predicts heat dissipation patterns across complex 3D architectures instantly.

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By integrating our AI model into the physical design and floorplanning phase, engineers can identify "thermal hotspots" before a single layer is fabricated. This allows for the intelligent placement of microfluidic cooling channels and thermal vias, ensuring that the chip can maintain peak clock speeds without triggering aggressive thermal throttling. The result is a more powerful, more efficient silicon footprint.

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Furthermore, BeyondMath addresses the long-term reliability of these complex assemblies. Thermal cycling—the constant heating and cooling of the chip—is a leading cause of mechanical failure at the interconnect level. Our model simulates these stresses across millions of cycles in seconds, allowing architects to choose materials and geometries that resist warping and delamination, extending the lifecycle of the hardware in data centers and edge devices.